منابع مشابه
Copper Pitting and Brass Dezincification: Chemical and Physical Effects
OBJECTIVES: The key hypothesis of this project was that both chemical and physical factors associated with real plumbing systems may influence copper pitting and brass dezincification corrosion, and thus the project was aimed at better understanding these factors. In addition to a comprehensive review of the literature on brass dezincification in potable water systems, experimental work was und...
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Physical vapor deposition under conditions of an obliquely incident flux results in a film formation with an inclined columnar structure. These columns will be oriented toward the vapor source because of the self-shadowing effect, and they are homogenously distributed on the substrate surface because of the limited surface diffusion ability of ad-atoms when there is no additional substrate heat...
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Printed circuit board (PCB) waste is generally dumped as a landfilling or treated pyrometallurg ically, which consumes enormous power, generates hazardous gases and also destroys valuable PCB components. For recycling of the components, they must be separated from the printed circuit boards which is a cumbersome task. For its simplification, the rate of d issolution of solder with acids like Hy...
متن کاملStable copper-tin cluster compositions from high-temperature annealing.
Copper-doped tin clusters can be thermally annealed to much more stable compositions with a substantially higher copper/tin ratio. The annealed clusters are only prominent over a narrow range of compositions: CuSn(10-15)+, Cu2Sn(12-18)+, Cu3Sn(15-21)+, Cu4Sn(18-(24)+, and Cu5Sn(21-(27)+. These compositions are close to those found for W(m)Si(n)+ clusters, raising the possibility that the Cu(m)S...
متن کاملWettability of Liquid Tin on Solid Copper* By
For obtaining good joints by soldering, a wettability of liquid metal on the solid metal surface, relatlatte, relattlated o solderability, is one of the most important factors, and the wettability is accelerated by using a suitable flux and atmosphere. In atmosphere soldering the flow of molten solder will be retarded by oxide films on base metals formed by a small amount of oxygen in atmospher...
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ژورنال
عنوان ژورنال: The William and Mary Quarterly
سال: 1951
ISSN: 0043-5597
DOI: 10.2307/1917447